20-layers circuit board
A 20-layer flexible circuit board (FPC) is a highly advanced and versatile electronic component designed for applications requiring flexibility, durability, and compactness.
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Parameter
| Key Attributes | Details |
| Industry-specific Attributes | |
| Base Material | PI |
| Board Thickness | 0.06-0.29mm |
| Board Size | 240mm/480mm/2000mm |
| Other Attributes | |
| Type | 20-layers circuit board |
| Copper Thickness | 0.03oz-2oz |
| Min. Hole Size | 0.1mm |
| Min. Line Width | 3mil [0.075mm] |
| Min. Line Spacing | 3mil [0.075mm] |
| Surface Finishing | OSP |
| Color | Green, Customized |
| Express | DHL, FEDEX, UPS, TNT, Ect |
| Package | Vacuum Package |
| Supply Ability | |
| Supply Ability | 100,000 Piece/Pieces per Week |
Key parameters and characteristics include:
1. Material Properties:
Conductive Layers: Made of high-performance conductive materials such as copper or aluminum, designed for reliable signal transmission.
Insulating Layers: Composed of flexible and durable insulating materials like PBT or glass-mat to ensure electrical separation and heat dissipation.
Copper Clad Substrate: A rigid support layer made of high-strength materials to maintain structural integrity under bending and twisting.
2. Mechanical Characteristics:
Bending Strength: Capable of withstanding repeated bending and folding without damage or failure.
Temperature Range: Operates effectively over a wide temperature range (-40°C to +125°C) with excellent thermal shock resistance.
Longevity: Designed to maintain performance over millions of flexing cycles, ensuring reliability in long-term use.
3. Electrical Characteristics:
Signal Integrity: Low resistance and minimal parasitic inductance/capacitance, ensuring high-speed signal integrity.
High Density: Can accommodate 20 layers of traces, providing high-density connectivity and compact design.
Resistance to Environmental Factors: Shows excellent resistance to moisture, chemicals, and electromagnetic interference (EMI).
4. Special Features:
Multi-Layer Flexibility: Combines multiple layers of flexible substrates and conductive layers for enhanced flexibility and load distribution.
Adaptability: Suitable for harsh environments, including radiation, corrosive liquids, and extreme temperatures.
These features make 20-layer flexible circuit boards ideal for a wide range of applications, including touchscreens, sensors, and wearable devices.
