|Layer is the number of layers of the design file, and to the final announcement of the site prevail.
|Materials Type: Supply FR4, Aluminum ,Rogers,Taconic,ect.
|Only allowed to receive 550x400mm, and the other can be connected to the long board 1200mm currently.
|Board Thickness Range
|Board Thickness Tolerance ( t≥1.0mm)
|Notes: Due to the production process causes (like Plating copper, sold mask, Solder coating will increase the thickness of the Board) generally take a positive tolerance.
|Min Line Width
|Line width be possible greater than 3mil, and the minimum is not less than 3mil; for multiple layer board: both the inner and outer layer can not be less than 0.1mm.
|Min Line Space
|The gap is possible to greater than 3mil,and the minimum is not less than 3mil.
|Outer Layer Finished Copper Thickness
|Refers to the thickness of the copper foil in the outer finished circuit board ,1 OZ＝35um 3 OZ=105um.
|Inner Layer Finished Copper Thickness
|Refer to the Finished Thickness of Multi Inner Layer Copper .
|Drilling hole(machine drill)
|0.3mm is the min hole and 6.3mm is the max hole, if bigger than 6.3mm the factory need process it separately.
|Single Side Welding Ring
|There has no single side limit If the conductive hole or plug hole is too small, but had enough space; If there is not enough space, the Min single side welding ring should not less than 0.153mm.
|Finished Hole Diameter(machine drill)
|Due to there has metal copper stick in the inner hole, the hole diameter of the hole is generally smaller than the hole in Original file.
|Hole Tolerance(machine drill)
|The tolerance of drilling hole is 0.08mm, for example, the hole is designed to be 0.6mm, and the finished hole of the real board is qualified in the 0.52–0.68mm.
|Photosensitive ink is the most common type now. thermosetting ink is used in low-grade single-sided cardboard generally.
|Min Legend Width
|If the minimum width of the Legend is less than 0.15mm, the actual board may not clear which caused by the design reasons.
|Min Legend Height
|If the minimum height of the Legend is less than 0.8mm, the actual board may not clear which caused by the design reasons.
|Legend Aspect Ratio
|The most appropriate aspect ratio, more facilitate to production.
|Space between Line and Outline
|If come out by Routing, the distance between the line and the line layer is not less than 0.3mm; if come out by the V cut ,the distance from the center line to the V cutting line can not be less than 0.4mm.
|Make-up: Gapless imposition clearance
|Clearance of the intermediate plate and the plate is 0 (a detailed document)
|Panelization: Gap Requires
|For the clearance gap is no less than 1.6mm, otherwise routing is very hard.
|Pads(Manufacturer pave copper)
|Hatch pave copper
|Manufacturer are using the reduction method, Pay attention to it for use Pads design customers.
|Pads Software to Draw the Slot
|With drill Drawing layer
|If there has many Non-PHT Slot , please draw in the Drill Drawing layer.
|Draw Windowing Layer In Protel/Dxp
|A few engineers put to the paste layer, we will not process paste layer.Attention
|Outline Layer In Protel/Dxp
|Use Keep out layer or Mechanical layer
|Notes: One file only allows one Outline layer exist , and never allow two Outline layer one time. please remove the useless outline layer, that is, Keep out layer and mechanical layer can only choose one.
|Half Hole :Min Half Hole Diameter/Dxp
|Half hole process is a special process, and the min hole dia should be bigger than 0.6mm.
|Solder mask is often said green color, it can be done in the process of soldmask Bridge.