ItemProduction CapacityProcess Description
Layer1-18 LayersLayer is the number of layers of the design file, and to the final announcement of the site prevail.
Materials TypeFR-4 (KB)Materials Type: Supply FR4, Aluminum ,Rogers,Taconic,ect.
Max size500x1100mmOnly allowed to receive 550x400mm, and the other can be connected to the long board 1200mm currently.
Dimension Precision±0.1mmOutline tolerance
Board Thickness Range0.2–3.4mmProduce: 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0/4.0mm
Board Thickness Tolerance ( t≥1.0mm)± 10%Notes: Due to the production process causes (like Plating copper, sold mask, Solder coating will increase the thickness of the Board) generally take a positive tolerance.
Min Line Width4mil(0.1mm)Line width be possible greater than 3mil, and the minimum is not less than 3mil; for multiple layer board: both the inner and outer layer can not be less than 0.1mm.
Min Line Space4mil(0.1mm)The gap is possible to greater than 3mil,and the minimum is not less than 3mil.
Outer Layer Finished Copper Thickness35um/105um(1OZ/3OZ)Refers to the thickness of the copper foil in the outer finished circuit board ,1 OZ=35um 3 OZ=105um.
Inner Layer Finished Copper Thickness17um(0.5 OZ)Refer to the Finished Thickness of Multi Inner Layer Copper .
Drilling hole(machine drill)0.3–6.3mm0.3mm is the min hole and 6.3mm is the max hole, if bigger than 6.3mm the factory need process it separately.
Single Side Welding Ring≥0.153mm(6mil)There has no single side limit If the conductive hole or plug hole is too small, but had enough space; If there is not enough space, the Min single side welding ring should not less than 0.153mm.
Finished Hole Diameter(machine drill)0.2–6.20mmDue to there has metal copper stick in the inner hole, the hole diameter of the hole is generally smaller than the hole in Original file.
Hole Tolerance(machine drill)±0.08mmThe tolerance of drilling hole is 0.08mm, for example, the hole is designed to be 0.6mm, and the finished hole of the real board is qualified in the 0.52–0.68mm.
Solder TypePhotosensitive inkPhotosensitive ink is the most common type now. thermosetting ink is used in low-grade single-sided cardboard generally.
Min Legend Width≥0.15mmIf the minimum width of the Legend is less than 0.15mm, the actual board may not clear which caused by the design reasons.
Min Legend Height≥0.8mmIf the minimum height of the Legend is less than 0.8mm, the actual board may not clear which caused by the design reasons.
Legend Aspect Ratio1:5The most appropriate aspect ratio, more facilitate to production.
Space between Line and Outline≥0.3mm(12mil)If come out by Routing, the distance between the line and the line layer is not less than 0.3mm; if come out by the V cut ,the distance from the center line to the V cutting line can not be less than 0.4mm.
Make-up: Gapless imposition clearance“0”gapClearance of the intermediate plate and the plate is 0 (a detailed document)
Panelization: Gap Requires1.6mmFor the clearance gap is no less than 1.6mm, otherwise routing is very hard.
Pads(Manufacturer pave copper)Hatch pave copperManufacturer are using the reduction method, Pay attention to it for use Pads design customers.
Pads Software to Draw the SlotWith drill Drawing layerIf there has many Non-PHT Slot , please draw in the Drill Drawing layer.
Draw Windowing Layer In Protel/DxpSolder layerA few engineers put to the paste layer, we will not process paste layer.Attention
Outline Layer In Protel/DxpUse Keep out layer or Mechanical layerNotes: One file only allows one Outline layer exist , and never allow two Outline layer one time. please remove the useless outline layer, that is, Keep out layer and mechanical layer can only choose one.
Half Hole :Min Half Hole Diameter/Dxp0.6mmHalf hole process is a special process, and the min hole dia should be bigger than 0.6mm.
Soldermask Opening0.1mmSolder mask is often said green color, it can be done in the process of soldmask Bridge.