12 Layers 3 order HDI Communication PCB
3 order HDI hdi PCB stackup is a high-rise high-density PCB board produced using micro-blind buried via technology with relatively high line distribution density. 3 order HDI hdi PCB stackup is widely used in mobile phones, digital (camera), MP3, MP4, notebook computers, automotive electronics, etc.
Share to:
| Key attributes |
| Industry-specific attributes |
| Base Material: Fr4, Any specialized material as per your choice |
| Board Thickness: 0.3 mm- 4 mm |
| Other attributes |
| Copper Thickness:0.3- 6 OZ |
| Min. Hole Size:0.2 mm |
| Min. Line Width:0.1 mm |
| Min. Line Spacing:0.1 mm |
| Surface Finishing:Lead/ Lead-free HASL, ENIG, Silver, OSP |
| Maximum Processing Area:680 x 1000MM |
| Number of Layer:1- 28 Layer |
| Silkscreen color:Black, White, Red, Green |
| MOQ:1 PC |
| Finished Board:Thickness: ≤ 1.0MM, Tolerance:±0.1MM |
| Twisting and Bending:≤ 0.75%, Min: 0.5% |
| Range of TG:130 – 215 ℃ |
| Service:One-Stop OEM Service |
| Certificate:ISO9001.ROSH.UL |
| Packaging and delivery |
| Package Type:Inner packing: Vacuum packing / Plastic bag Outer packing: Standard carton packing |
| attribute-list |
| Supply Ability:45000 Square Meter/Square Meters per Month |
