12 Layers 3 order HDI Communication PCB

12 Layers 3 order HDI Communication PCB

3 order HDI PCB is a high-rise high-density PCB board produced using micro-blind buried via technology with relatively high line distribution density. 3 order HDI PCB is widely used in mobile phones, digital (camera), MP3, MP4, notebook computers, automotive electronics, etc.

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Key attributes
Industry-specific attributes
Base Material: Fr4, Any specialized material as per your choice
Board Thickness: 0.3 mm- 4 mm
Other attributes
Copper Thickness:0.3- 6 OZ
Min. Hole Size:0.2 mm
Min. Line Width:0.1 mm
Min. Line Spacing:0.1 mm
Surface Finishing:Lead/ Lead-free HASL, ENIG, Silver, OSP
Maximum Processing Area:680 x 1000MM
Number of Layer:1- 28 Layer
Silkscreen color:Black, White, Red, Green
MOQ:1 PC
Finished Board:Thickness: ≤ 1.0MM, Tolerance:±0.1MM
Twisting and Bending:≤ 0.75%, Min: 0.5%
Range of TG:130 – 215 ℃
Service:One-Stop OEM Service
Certificate:ISO9001.ROSH.UL
Packaging and delivery
Package Type:Inner packing: Vacuum packing / Plastic bag Outer packing: Standard carton packing
attribute-list
Supply Ability:45000 Square Meter/Square Meters per Month

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