12 Layers 3 order HDI Communication PCB
3 order HDI PCB is a high-rise high-density PCB board produced using micro-blind buried via technology with relatively high line distribution density. 3 order HDI PCB is widely used in mobile phones, digital (camera), MP3, MP4, notebook computers, automotive electronics, etc.
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Key attributes |
Industry-specific attributes |
Base Material: Fr4, Any specialized material as per your choice |
Board Thickness: 0.3 mm- 4 mm |
Other attributes |
Copper Thickness:0.3- 6 OZ |
Min. Hole Size:0.2 mm |
Min. Line Width:0.1 mm |
Min. Line Spacing:0.1 mm |
Surface Finishing:Lead/ Lead-free HASL, ENIG, Silver, OSP |
Maximum Processing Area:680 x 1000MM |
Number of Layer:1- 28 Layer |
Silkscreen color:Black, White, Red, Green |
MOQ:1 PC |
Finished Board:Thickness: ≤ 1.0MM, Tolerance:±0.1MM |
Twisting and Bending:≤ 0.75%, Min: 0.5% |
Range of TG:130 – 215 ℃ |
Service:One-Stop OEM Service |
Certificate:ISO9001.ROSH.UL |
Packaging and delivery |
Package Type:Inner packing: Vacuum packing / Plastic bag Outer packing: Standard carton packing |
attribute-list |
Supply Ability:45000 Square Meter/Square Meters per Month |